BR2266e
Module 模组 |
BR2266e |
Hardware architecture (硬件架构) |
SoC (硬件集成了蓝牙协议栈的软件实现,不占用系统资源,开发难度低) |
Chip 主芯片 |
BR1001 |
Size(mm) 大小 |
16.5*13.3*2.3 |
Bluetooth specification 蓝牙规范 |
V5.0,Single Mode |
Temperature range(℃) 温度范围 |
-40 to +85 |
Operating voltage(V) 工作电压 |
3.3 |
Bluetooth class 蓝牙标准 |
Class 2 |
Range,line of sight(m) 传输距离 |
Classic:- BLE:45 |
Antenna 天线 |
Internal |
Transmit power(dBm) 发射功率 |
2 |
Receiver sensitivity(dBm) 接收灵敏度 |
-90 |
Consumption 功耗 |
15uA |
– | |
300uA | |
150uA | |
2.9mA | |
4.8mA | |
Pins 引脚个数 |
28 |
Host Interfaces 主机接口 |
UART |
Peripheral Interfaces 外设接口 |
GPIO,SPI,I2C,ADC |
Shielding case 屏蔽罩,默认出货状态 |
Yes |
Weight(g) 重量 |
– |
Profiles (蓝牙应用) |
GATT,Airsync |
Support mode 主从模式 |
Master and slave |
Multi-Connection 多连接 |
3 gatt as periphearl+3 gatt as server |
Maximum Throughput 传输速度 |
SPP:- GATT:8KB/s |
Firmware upgrade 固件升级 |
UART,OTA |
Memory 存储 |
128K RAM, 256K ROM |
Number of compatible phones 兼容手机数量 |
GATT:600+ |
Key Feature 关键特性 |
Low energy Support Master or Slave roles Integrated antenna Industrial temperature range from -40℃ to +85℃ RoHS Compliant |
Certifications 认证 |
BQB,FCC,CE,TELEC |